Description
Sapphire NITRO+ AMD Radeon RX 7900 XTX Vapor-X 24GB graphics card
The evaporation chamber is mounted in contact with the surface of the main chip and memory. Since the entire area dissipates heat at the same rate, the Vapor-X module has been designed to dissipate heat more efficiently than a copper heatsink. Once the temperature rises, heat is delivered to the vaporization wicks to begin the heat dissipation process. Due to the extremely low pressure, the working fluid and pure water is easily vaporized and carried through the vacuum until it reaches the condensing wick, which is adjacent to the surface to be cooled. From here it is returned to a liquid state, whereby the liquid is then sucked into the transport wick by capillary action and transported back to the evaporating wick. The liquid recirculation system occurs when the heat source re-heats the liquid and it is re-vaporized by the vapor wick to restart the Vapor-X cooling process.